Gap Pad

Gap Pad is a thermally conductive interface material, designed to fill the air gaps between hot devices and their heat spreaders. Gap Pad is a highly conformable, low modulus polymer, which is available in a range of thicknesses from 0.020" to 0.160". Gap Pad is also available with or without adhesive. As always, QuanYi can provide Gap Pad in custom sizes or die cut shapes, to precisely fit your requirements. For additional information see our website, or contact our sales department. Samples of this, and other thermal interface materials are immediately available upon request.

The QuanYi Electronics Co., Ltd. developed the Gap Pad thermal interface material family to meet the electronics industry's growing need for interface materials with greater conformability, higher thermal performance and easier application.

Gap Pad provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough surface textures are present.

Gap Pad property

• Elimination of air gaps to reduce thermal resistance
• High conformability to reduce interfacial resisitance
• Low-stress vibration dampening
• Compatible with automated dispensing equipment

As always, all of these materials are available as die cut parts, either as custom products or in standard configurations. Please contact your QuanYi sales representative for additional information on Gap-Pad, and for a list of standard configurations.